New 8Gb, 16Gb, and 32Gb CMOS DDR4 SDRAMs
Alliance Memory has expanded its portfolio of CMOS DDR4 SDRAMs with six new 8Gb, 16Gb, and 32Gb devices in 78-ball FBGA and 96-ball FBGA packages. Part Numbers:
Key Specifications and Benefits:
|
Target Applications:
- 5G and IoT designs
- Portable electronics such as smartphones and tablets
- Computing applications; surveillance, gaming, and networking storage systems; smart meters; and human-machine interfaces (HMI), digital signal controllers, and PNDs
The Context:
Providing Alliance Memory’s customers with higher-density options for a wide range of applications, the AS4C512M16D4B-62BCN, AS4C1G8D4B-62BCN, AS4C1G16D4A-62BCN, AS4C2G8D4A-62BCN, AS4C2G16D4-62BCN, and AS4C4G8D4-62BCN are built on a new process technology to deliver improved performance — with lower power consumption and higher speeds and transfer rates — at a lower cost.
With minimal die shrinks, the DDR4 SDRAMs provide reliable drop-in, pin-for-pin-compatible replacement for numerous similar solutions — eliminating the need for costly redesigns and part requalification. Offered in the commercial (0°C to +95°C) temperature range, the devices are ideal for the industrial, networking, telecommunications, gaming, and consumer markets.
Availability: Samples and production quantities of the new CMOS DDR4 SDRAMs are available now, with lead times of 4 weeks.